Specification
|
product: |
Copper paste |
|
Part number: |
01L-5905 |
Application:
Single-component conductive paste series, a low-temperature copper paste for filling holes, dense, with excellent conductivity, can provide excellent conductivity and has good printing properties, oxidation resistance. Its conductivity will not significantly change due to processing and forming after printing or bending during product use. Screen printing.
Operating conditions：
|
Substrate |
Suitable for Ceramic, Pet, PI etc |
|
Method of use |
200-250 mesh stainless screen |
|
Levelling |
3-5min minutes at room temperature
|
|
Curing conditions |
In an oven maintained at 80-150℃ for 10-30 minutes. (This is for reference only. The specific baking temperature and duration can be set according to actual requirements.) |
|
Thinner |
ST-1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤15μm |
FOG test |
|
2 |
Viscosity |
200-420Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ , Brookfield HBT |
|
|
|
|
The viscosity can be adjusted according to the actual needs of the user. |
|
3 |
content |
70% |
copper ，Glue |
Characteristics after curing：
Check fired film produced under the conditions specified in 1）,
|
Characteristics |
Standard |
Test method and conditions |
|
|
4 |
Resistivity |
≤150mΩ/□ |
Cured film thickness 10-25μm, test pattern 100mm * 1mm |
|
5 |
Hardness |
2H |
Pencil hardness |
|
6 |
Adhesion |
Not fall off |
3M 600#Tape 90°Pull |
Storage condition and Term of validity
The product shall be guaranteed for 6 months after shipping date, keep tightly under at 5-15℃
Packaging method：
Standard package 1000g/can ，if you need sample to test, available 200g with small package.
