| 80 - 150℃ curing low-temperature copper paste | ||
| Part Number | Ingredients |
Application field, Main feature |
|
Application field |
Low-temperature copper paste |
①It can be printed by screen printing, spot coating, or sprayed after dilution (a special diluent ST1001 needs to be added) |
Specification
|
product: |
Copper paste |
|
Part number: |
25L-2211 |
※ Heating and curing the copper paste at a temperature range of 80 to 150 degrees Celsius
※ Suitable for flexible substrates, ceramics, glass, metals, etc. ※ High copper content, low resistance
※ Excellent adhesion
|
Substrate |
Suitable for Ceramic, Pet, PI ，Pc etc |
|
|
Method of use |
250-350 mesh stainless screen |
|
|
Leveling |
3-5min minutes at room temperature
|
|
|
Curing conditions |
In a constant-temperature oven, or with continuous hot air (either of these conditions is sufficient) | |
|
80℃ |
60 分钟/mins |
|
|
120℃ |
20 分钟/mins |
|
|
150℃ |
15 分钟/mins |
|
|
Fineness |
≤5μm |
FOG test |
|
Viscosity |
100-180Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ , |
|
|
|
Brookfield HBT（ SC4-14/6R), 10rpm, 25±1℃
|
|
content |
65-80% |
Silver ，Glue |
|
Resistivity |
≤200mΩ/□ |
Cured film thickness 10-25μm, test pattern 100mm * 1mm |
|
≤100mΩ/□ |
Four-needle probe 25.4u |
|
|
Adhesion |
Not fall off |
3M 600#Tape 90°Pull |
Application:
Single-component conductive paste series can be widely applied in flexible printed circuits, notebook keyboard circuits, radio frequency interference shielding, RFID, toy, learning machine circuit printing and contact printing, etc. They can be used on oxide aluminum ceramics, microcrystalline glass ceramics, PET, PC and other sheet materials. They can provide excellent conductivity and film adhesion properties, have good printability, flexibility and extremely strong adhesion. Their conductivity will not undergo significant deviation due to processing and forming after printing or bending changes during product use. Screen printing and spraying are both possible.
Operating conditions：
|
Substrate |
Suitable for Ceramic, Pet, PI etc |
|
Method of use |
200-250 mesh stainless screen |
|
Levelling |
3-5min minutes at room temperature |
|
Curing conditions |
In the constant-temperature oven 80℃ , 60 mins ，120℃ 20mins ，150℃ 10mins ， 180℃ 5mins (For reference, the baking temperature and baking time can be set according to actual needs) |
|
|
|
|
|
|
|
|
|
|
Thinner |
ST-1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
80-220Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ , |
|
|
Viscosity |
|
Brookfield HBT viscometer, rotor SC4-14/6R), 10 rpm, 25 ± 1℃ The viscosity can be adjusted according to the actual needs of the user. |
|
3 |
content |
65-80% |
Copper ，Glue |
Characteristics after curing：
Check fired film produced under the conditions specified in 1）,
|
Characteristics |
Standard |
Test method and conditions |
|
|
4 |
Resistivity
|
≤200mΩ/□ |
Cured film thickness 10-25μm, test pattern 100mm * 1mm |
|
|
|
≤100mΩ/□ |
Four-needle probe 25.4u |
|
5 |
Hardness |
3H |
Pencil hardness |
|
6 |
Adhesion |
Not fall off |
3M 600#Tape 90°Pull |
Storage condition and Term of validity
The product shall be guaranteed for 6 months after shipping date, keep tightly under at 5-15℃
Packaging method：
Standard package 1000g/can ，if you need sample to test, available 200g with small package.
