Application:
Suitable for high-temperature thick film circuits, LTCC ceramics, and laminated component via filling and conductive electrodes.
Operating conditions：
|
Substrate |
Alumina ceramic |
|
Printing |
200-300 mesh stainless screen |
|
Drying &Sintering |
Single layer printing(Alumina ceramic)100-150℃ , 10-15 分钟 100-150℃ 10-15 min Sintering in air with a peak temperature of 850°C (minimum recommended value) for 2 to 10 hours. (The sintering temperature can be adjusted upward according to actual needs from 850°C to 1400°C.) |
|
Multilayer printing Binder removing, 200-500℃ , 60 mins at least Sintering in air with a peak temperature of 850°C (minimum recommended value) for 2 to 10 hours. (The sintering temperature can be adjusted upward according to actual needs from 850°C to 1400°C.) |
|
|
Thinner |
ST-1000 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
280-530Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ , Brookfield HBT |
Characteristics after firing：
Check fired film produced under the conditions specified in 1 ）, (Film thickness is 8-12μm.)
|
Characteristics |
Standard |
Test method and conditions |
|
|
3 |
Resistivity |
≤80mΩ/ □ |
Testpattern 0.6mm×60mm |
|
4 |
Adhesion strength |
|
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. Solder: 96.5Sn/0.5Cu Mildly activated flux used. |
|
|
Initial |
≥33.2N |
|
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can ，if you need sample to test, available 200g with small package.
