Specification
| Product: | Conductive Silver Paste | |||||
| Part Number: | 01H-0705 | |||||
Application Scope :
This product is suitable for use with heating plate electrodes such as microcrystalline glass.
Usage Conditions :
| Substrate | Glass ceramics | ||||||
| Printing | 200-300 mesh screen printing | ||||||
| Leveling | Let it level at room temperature for 5-15 minutes (adjust time based on actual leveling conditions). |
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| Drying | Bake in a ventilation oven at 100-150°C for 10-15 minutes (the test temperature should be below 300°C, and the baking time can be adjusted based on actual conditions). |
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| Firing Condition | The sintering temperature is 800℃ (recommended value) and the sintering time is 9-11 minutes. |
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| Thinner | ST-1000 | ||||||
Characteristics :
1. Paste Characteristics :
| Characteristic | Standard | Test Method And Conditions | |||||
| 1 | Fineness | ≤5μm | FOG test | ||||
| 2 | Viscosity | 80-280Pa.s | Brookfield HBT (Boli Fei) viscometer, rotor SC4-14/6R, operating at 10rpm and 25±1°C, with adjustable viscosity according to user requirements. |
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2. Characteristics After Curing :
Under the 1-sintering condition, the film thickness is 8-12 μm.
Check fired film produced under the conditions specified in 1 ）, (Film thickness is 8-12μm.)
| Characteristics | Standard | Test Method And Conditions | |||||
| 3 | Resistivity | ≤5mΩ/□ | Test pattern 0.6mm×60mm | ||||
4 |
Adhesion Strength |
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. Solder: 96.5Sn/0.5Cu Mildly activated flux used. |
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| Initial Adhesion |
≥43.2N | ||||||
| Ageing Adhesion |
≥22.6N | Aging conditions: 150°C, 24 hours | |||||
Save Conditions And Validity Period :
The product shall be stored in a sealed container at an ambient temperature of 5-25°C, with a shelf life of
1 year from the date of shipment.
Packaging Method :
Standard packaging, 1000g/can; samples are available in 200g small can packaging.
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