Sryeo paste

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P/N Composition Firing Temperature Key Features & Applications Datasheet
25H-5901 Filling hole copper paste Sintering at 850℃ Sintered at 850℃, used for filling the holes and ensuring electrical connection at both ends. Click to view details
25H-1805 High-temperature copper paste Sintering at 850℃ Sintered at 850℃, printed circuit electrodes Click to view details
25L-5905 Filling hole copper paste Bake at 80 - 200℃ Bake and solidify the copper paste at 80 - 200℃ for filling holes and achieving upper and lower conductivity. Click to view details
25L-2211 Low-temperature copper paste Bake at 80 - 200℃ Bake and solidify the copper paste at 80 - 200℃. This is a printing type and is used for making printing electrodes. Click to view details
25L-2908A Quick-drying copper paste Room temperature quick-drying copper paste Click to view details

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  • Singaporean company：82, Lorong 23 Geylang ,#16-18, The Atrix, Singapore 388409 +65 6744 9665
  • Shenzhen Company：No. 1, Huayun Road, Longhua District, Shenzhen City, Jinbolong Industrial Zone
  • Dongguan Factory：Factory Building No. 33, Jewelry Industrial Park, Huan Chang North Road, Changping Town, Dongguan City
  • Telephone and WeChat：13510026516 (WeChat Group Chat Number），0755-83286303
  • E-mail：sales@sryeo.com
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