Specification
|
product: |
Through hole Cu paste |
|
Part number: |
25H-5901 |
Application:
Suitable for LTCC 、LED etc, Ceramic circuit through hole.
Operating conditions：
|
Substrate |
Ceramic circuit |
|
Printing |
Screen printing |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
Place in a ventilated oven and bake at 100-150℃ for 10-15 minutes. (Drying temperature is below 300℃. The drying time can be determined according to the actual situation of the baking process.) |
|
Firing Condition |
The sintering process is carried out under nitrogen protection atmosphere in the tunnel furnace, with a peak temperature of 830 ± 10℃ (recommended value), for 10 - 20 minutes. (As per actual requirements, the sintering range can be adjusted within 800-850℃, but the peak temperature duration must be at least 10 minutes.) |
|
Thinner |
ST-1000 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
200-580Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃ , Brookfield HBT |
Characteristics after firing：
Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12μm.)
|
Characteristics |
Standard |
Test method and conditions |
|
|
3 |
Resistivity |
≤20mΩ/□ |
Test pattern 0.6mm×60mm |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can ，if you need sample to test, available 200g with small package.
