Product Specification
| Product: | Conductive Silver Paste | ||||
| Part Number: | 01L-2608B |
※ Silver paste cured at 150-200°C
※ Maximum temperature resistance: 300°C, 350°C for 2 hours
※ Suitable for bonding chips, ceramics, glass, and metals
※ Compatible with dispensing and printing processes
Application Scope :
The single-component conductor paste series is a conductive silver paste with reliable adhesion for
chip fixation. This paste is suitable for bonding various chips onto substrates such as circuit boards,
glass, and ceramics, as well as spotlights. It is designed for flexible circuits requiring temperature
resistance above 150°C, demonstrating excellent compatibility with substrates without sagging.
Electrodes fabricated with this paste exhibit a glossy, fine-textured appearance and dense structure
after curing.
| Substrate | Circuit, Glass, Ceramic, Metal, Chip, PI | |||||
| Usage Method | Dotting, printing, smearing | |||||
| Leveling | Level at room temperature for 3-5 minutes (time adjusted based on actual leveling conditions) |
|||||
| Solidify | In an incubator, or continuous hot air (choose one of the following conditions) | |||||
| 150℃ | 60 minutes | |||||
| 180℃ | 30 minutes | |||||
| 200℃ | 30 minutes | |||||
| 250℃ | 20 minutes | |||||
| Viscosity | 120-220Pa.s | Brookfield HBT (Boli Fei) viscometer, rotor SC4-14/6R, 10 rpm, with adjustable viscosity at 25±1°C according to user requirements. |
||||
| Solid Content | 65-80% | Silver ，Glue | ||||
| Resistivity | ≤20mΩ/□ | Square resistance test method (after curing at 300°C for 20 minutes) The cured film thickness is 10μm, and the test pattern size is 100mm*1mm. |
||||
| ≤10mΩ/□ | Four-pin probe method 25.4u | |||||
| Adhesion | Not fall off | 3M 600#Tape 90° Pull | ||||
| Differences | 01L-2608B | Adhesive type, with balanced conductivity, suitable for most products. |
||||
| 01L-2609S | It exhibits stronger adhesion, though slightly higher resistance than 01L-2608B. |
|||||
Usage Conditions :
| Substrate | Circuit, Glass, Ceramic, Metal, Chip, PI | |||||
| Usage Method | Dotting, Printing | |||||
| Leveling | Let it level at room temperature for 5-10 minutes (adjust time based on actual leveling conditions). |
|||||
| Solidify | Furnace drying at 150–200°C for 30 minutes The curing temperature can be within the range of 150-200°C, and the curing time can be determined based on actual conditions. |
|||||
| Thinner | ST-1001 | |||||
Characteristics :
1. Paste Characteristics :
| Characteristic | Standard | Test Method And Conditions | ||||
| 1 | Fineness | ≤15μm | FOG test | |||
| 2 | Viscosity | 80-280Pa.s | Brookfield HBT (Boli Fei) viscometer, rotor SC4-14/6R, 10 rpm, with adjustable viscosity at 25±1°C according to user requirements. |
|||
| 3 | Solid Content |
70 | Silver | |||
2. Characteristics After Curing :
Under the condition of 1 sintering, Check fired film produced under the conditions specified in 1）
| Characteristics | Standard | Test Method And Conditions | ||||
| 4 | Resistivity | ≤30mΩ/□ | ||||
| 5 | Hardness | 4H | Pencil hardness | |||
| 6 | Shear Strength |
12Mpa | ||||
Save Conditions And Validity Period :
The product shall be stored in a sealed container at an ambient temperature of 5-15。C, with a shelf
life of six months from the date of shipment.
Packaging Method :
Standard packaging, 1000g/can; samples are available in 200g small can packaging.
