Product Specification
| Product: | Conductive Silver Paste | ||||
| Part Number: | 01L-2609S |
Application Scope :
Single-component conductive paste series, a conductive silver paste with reliable adhesion for chip
fixation. This paste is suitable for bonding various chips onto substrates such as circuit boards, glass,
and ceramics, exhibiting excellent compatibility with the substrate without sagging. Electrodes
fabricated with this paste exhibit a glossy, fine appearance and dense structure after curing.
Usage Conditions :
| Substrate | Circuits, glass, ceramics, metals | |||||
| Usage Method | Adhesive and dispense | |||||
| Leveling | Let it level at room temperature for 5-10 minutes (adjust time based on actual leveling conditions). |
|||||
| Solidify | Furnace drying at 120–150°C for 30 minutes The curing temperature can be within the range of 130-180°C, and the curing time can be determined based on actual conditions. |
|||||
| Thinner | ST-1001 | |||||
Characteristics :
1. Paste Characteristics :
| Characteristic | Standard | Test Method And Conditions | ||||
| 1 | Fineness | ≤15μm | FOG test | |||
| 2 | Viscosity | 120-320Pa.s | Brookfield HBT (Boli Fei) viscometer, rotor SC4-14/6R, 10 rpm, with adjustable viscosity at 25±1°C according to user requirements. |
|||
| 3 | Solid Content |
70 | Silver | |||
2. Characteristics After Curing :
Under the condition of 1 sintering, Check fired film produced under the conditions specified in 1）
| Characteristics | Standard | Test Method And Conditions | ||||
| 4 | Resistivity | ≤30mΩ/☑ | ||||
| 5 | Hardness | 4H | Pencil hardness | |||
| 6 | Shear Strength |
12Mpa | ||||
Save Conditions And Validity Period :
The product shall be stored in a sealed container at an ambient temperature of 5-15°C, with a shelf
life of six months from the date of shipment.
Packaging Method :
Standard packaging, 1000g/can; samples are available in 200g small can packaging.
