Specification
|
product: |
Dielectric paste |
|
part number: |
56M-1809 |
Application:
This specification applies to Glass ceramic package paste.
This slurry is suitable for encapsulating substrates such as microcrystalline glass ceramics. This material can be printed and applied by brushing. It has a low sintering temperature and, after firing, can withstand a temperature of 1000°C without any change in performance.
Operating conditions：
|
Substrate |
Glass ceramic |
|
Method of use |
Printing, 150-200mesh |
|
Levelling |
5-10min minutes at room temperature |
|
Curing conditions |
100-150℃ 10-15 min |
|
Firing Condition |
Atmospheric firing in belt furnace with peak time of 10 Minutes at 500℃ |
|
Thinner |
|
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
100~200Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
|
|
3 |
Appearance
|
Grey |
|
Characteristics after curing：
Film thickness is ＞80mm
|
Characteristics |
Standard |
Test method and conditions |
|
|
4 |
Appearance |
Compact and Dense |
Eyeballing |
|
5 |
Capacitance of unit |
≤3.0PF/mm2 |
KT2618 type |
|
6 |
Wastage of insulation |
＜1% |
KT2618 type |
|
7 |
Resistance of insulation |
＞106Ω（500VDC, 25℃） |
RCJ-3 type |
|
8 |
Breakdown voltage |
＞500VAC, 25℃ |
CS2673A type |
|
9 |
Constant insulation(ε) |
9～15 |
Calculation |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
