Specification
|
product: |
package paste |
|
part number: |
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Application:
The paste is suitable for marking thick film circuit and outside package, glass, ceramic, metal, etc.
Operating conditions：
|
Substrate |
thick film circuit, glass, ceramic, metal, etc. |
|
Method of use |
Printing, 200-250mesh |
|
Levelling |
5-10min minutes at room temperature
|
|
Curing conditions |
150~ ( It could be cured at a temperature between 150~ |
|
Thinner |
ST-1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
80~150Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25± Brookfield HBT |
|
3 |
Appearance
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white, black，blue, green |
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Characteristics after curing：
Check fired film produced under the conditions specified in 1）,
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Characteristics |
Standard
|
Test method and conditions |
|
|
4 |
Acid resistance
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Fine
|
Marinate in 5% H2S04, 30mins, no difference with standard sample
|
|
5 |
Insulation resistance
|
---- |
RCJ-30 |
|
6 |
Breakdown voltage
|
---- |
CS |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5
Packaging method：
Standard package
