Specification
|
product: |
ALN Thick Film Resist paste |
|
Part number: |
05H08 series |
Application:
The resist paste applies to ALN ceramic thick film circuit.
Operating conditions：
|
Substrate |
96% alumina、surface roughness 3-5μm |
|
Printing |
200-250 mesh stainless screen |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
100 |
|
Firing Condition |
Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 850± |
|
Thinner |
ST1000，ST1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
100-200Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25± Brookfield HBT |
Characteristics after firing：
Check fired film produced under the conditions specified in 1）, (Film thickness is 8
|
Characteristics |
Standard
|
Test method and conditions |
|
|
3 |
Appearance |
Compact and unknit |
Eyeballing |
|
4 |
Resistivity |
As below form |
Standard film thickness is |
|
TCR |
As below form |
HTCR 25 |
|
| Product series | Thick film circuitry uses resistor paste | ||||
|
Product NO
|
（Ω/□） |
Tolerance % |
Main Compositions |
TCR （ppm/℃） |
Low Temperature. Tolerance（%） |
|
05H08-1R0 |
1 |
±15% |
Ag、 Pd 、RuO2 |
-100~250 |
±2.5 |
|
05H08-2R0 |
2 |
±15% |
Ag、 Pd 、RuO2 |
-100~250 |
±2.5 |
|
05H08-5R0 |
5 |
±15% |
Ag、 Pd 、RuO2 |
-100~250 |
±2.5 |
|
05H08-011 |
10 |
±15% |
Ag、 Pd 、RuO2 |
-100~250 |
±2.5 |
|
05H08-021 |
20 |
±15% |
Ag、 Pd 、RuO2 |
-100~250 |
±2.5 |
|
05H08-051 |
50 |
±15% |
RuO2 |
-150~150 |
±1.5 |
|
05H08-101 |
100 |
±15% |
RuO2 |
-150~150 |
±1.0 |
|
05H08-501 |
500 |
±15% |
Pb2Ru2O6 |
-300~0 |
±1.0 |
|
05H08-102 |
1K |
±15% |
Pb2Ru2O6 |
-300~0 |
±1.0 |
Storage condition and Term of validity
The product should be stored in a sealed manner at an ambient temperature ranging from 5 to 25 degrees Celsius. The validity period is six months from the date of shipment.
Packaging method：
