Specification
|
Product: |
Wolfram paste |
|
Part number: |
32H-1801 |
Application:
Suitable for Ceramic circuit through hole.
The main features are as follows:
It is consistent with the ceramic shrinkage rate, and the bonding strength between sintering and ceramics is good.
The resistance value is small.
It can meet the requirements of printing and small hole filling processes.
The metal particles have good dispersion and the metallized surface should be flat.
Suitable for 95-96% alumina ceramics, especially suitable for metallization of dense ceramics.
Operating conditions：
|
Substrate |
Alumina ceramic |
|
Printing |
200-250 mesh stainless screen |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
The air circulation oven should be set to a temperature of 100 - 150℃ and baked for 10 - 15 minutes (the baking temperature should be below 230℃). |
|
Firing Condition |
Tunnel furnace sintering hydrogen atmosphere, the peak of 1350~1700℃ (recommended), at peak of 30-45minutes. |
|
Thinner |
ST-1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
280-500Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
|
Characteristics after firing：
Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12mm.)
|
Characteristics |
Standard
|
Test method and conditions |
|
|
3 |
Resistivity
|
≤20mΩ/□ |
Test pattern 0.6mm×60mm
|
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
