Specification
|
product: |
Ag/Pd paste |
|
Part number: |
02H-3650 |
Application:
Suitable for High-Temp thick film circuit、Piezo ceramic product electrode.
Operating conditions：
|
Substrate |
Piezo ceramic |
|
Printing |
200-300 mesh stainless screen |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
Single layer printing (Piezo ceramic)
100-150℃ 10-15 min
Atmospheric firing in belt furnace with peak time of 10 mins at 1000℃
|
|
Firing Condition |
Multilayer printing(Piezo ceramic raw)
Binder removing, 200-500℃，60 mins at least
Atmospheric firing in belt furnace with peak time 2-10 hours at 1000℃
（According to actual needs, can raise the temperature, but generally does not exceed 1250℃
|
|
Thinner |
ST-1000 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
130-280Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
Brookfield HBT
|
Characteristics after firing：
Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12mm.)
|
Characteristics |
Standard |
Test method and conditions |
|
|
3 |
Resistivity |
≤30mΩ/□ |
Test pattern 0.6mm×60mm |
|
4 |
Adhesion strength |
|
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. Solder: 96.5Sn/0.5Cu Mildly activated flux used.
|
|
Initial |
≥46.2N |
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Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
