High-temperature resin

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Part Number：09LWE03

Specification

product:	Dielectric paste
part number:	09L-WE03

Application:

This specification applies to thick film package paste.

Operating conditions：

Substrate	thick film circuit, glass, ceramic, metal, etc.
Method of use	Printing, 200-250mesh
Levelling	5-10min minutes at room temperature
Curing conditions	150~200℃, 20-30 min ( It could be cured at a temperature between 150~ 200°C, but it depends of the thickness and the substrate.)
Thinner	ST-1001

Characteristics：

Paste Characteristics：

Characteristic		Standard	Test method and conditions
1	Fineness	≤8μm	FOG test
2	Viscosity	80~150Pa.s	Brookfield HBT utility cup and spindle(SC4-14/6R),10rpm, 25±1℃，
3	Appearance	*gray*

Characteristics after curing：

Check fired film produced under the conditions specified in 1）,

Characteristics		Standard	Test method and conditions
4	Acid resistance	Fine	Marinate in 5% H2S04, 30mins, no difference with standard sample
5	Insulation resistance	≥10 4MΩ	RCJ-30
6	Breakdown voltage	≥300V	CS262673A

Storage condition and Term of validity

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃

Packaging method：

Standard package 1000g/can，if you need sample to test, available 200g with small package.

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Download of Specification Document