Specification
|
product: |
Silver paste |
|
Part number: |
01H-4900（series） |
Application:
Suitable for Tempered glass electrode & heating.
Operating conditions：
|
Substrate |
Tempered glass |
|
Printing |
200-300 mesh stainless screen |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
100-150℃ 10-15 min |
|
Firing Condition |
1. Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 600~750℃ Sintering with glass tempered together，600-750℃ |
|
Thinner |
ST-1000 |
Characteristics：
|
|
01H-4903 |
01H-4904 |
01H-4905 |
01H-4906 |
01H-4907 |
01H-4908 |
01H-4909 |
|
Fineness(um) |
≤5 |
≤5 |
≤5 |
≤5 |
≤5 |
≤5 |
≤5 |
|
Viscosity (pa.s) |
120-180 |
120-180 |
120-180 |
120-180 |
120-180 |
120-180 |
120-150 |
|
Silver content（%） |
80~85 |
75~80 |
70~75 |
65~70 |
60~65 |
55~60 |
50~55 |
|
Resistivity (mΩ/□) |
≤3 |
≤5 |
≤7 |
≤10 |
≤15 |
≤20 |
≤30 |
|
Adhesion (N) |
≥55 |
≥52 |
≥50 |
≥48 |
≥45 |
≥42 |
≥40 |
|
Standard |
Test method and conditions |
|
Fineness |
FOG test |
|
Viscosity
|
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT |
|
Resistivity
|
Fired film thickness is 8-12mm.) Test pattern 0.6mm×60mm |
|
Adhesion strength
|
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad.
Solder: 96.5Sn/0.5Cu Mildly activated flux used. |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
