Specification
|
product: |
Through hole Silver paste |
|
Part number: |
01M-5901 |
Application:
Suitable for LTCC、LED etc, Glass,Ceramic circuit through hole.
Operating conditions：
|
Substrate |
Ceramic circuit |
|
Printing |
Screen printing |
|
Levelling |
5-15min minutes at room temperature |
|
Drying |
100-150℃ 10-15 min |
|
Firing Condition |
Atmospheric firing in belt furnace with peak time of 10 Minutes at 550~600℃ |
|
Thinner |
ST-1000 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤5μm |
FOG test |
|
2 |
Viscosity |
200-580Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT |
Characteristics after firing：
Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12mm.)
|
Characteristics |
Standard |
Test method and conditions |
|
|
3 |
Resistivity |
≤5mΩ/□ |
Test pattern 0.6mm×60mm |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
