Specification
|
product: |
Dielectric paste |
|
part number: |
07MTGT40 |
Application:
The paste is suitable for through hole into thick film circuit、ceramic、glass、metal.
Operating conditions：
|
Substrate |
thick film circuit，alumina ceramic，glass, metal |
|
Method of use |
Printing, |
|
Levelling |
5-10min minutes at room temperature |
|
Curing conditions |
100-150℃ 10-15 min |
|
Firing Condition |
Atmospheric firing in belt furnace with peak time of 10~30 Minutes at 550±10℃ （According to actual needs, sintering range can be adjusted within 420-800℃） |
|
Thinner |
ST-1001 |
Characteristics：
Paste Characteristics：
|
Characteristic |
Standard |
Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
350~500Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT |
|
3 |
Appearance
|
Transparent |
|
Characteristics after curing：
Check fired film produced under the conditions specified in 1）,
|
Characteristics |
Standard |
Test method and conditions |
|
|
4 |
Appearance |
compact |
Visual inspect & microscope |
Storage condition and Term of validity
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-15℃
Packaging method：
Standard package 1000g/can，if you need sample to test, available 200g with small package.
