| P/N |
Composition |
Firing Temperature |
Key Features & Applications |
Datasheet |
| 02H-3650 |
Silver palladium paste |
850~1200℃ |
Multi-layer piezoelectric ceramic stack-fired inner electrodes, with a wide sintering temperature range of 850~1200℃, with a maximum temperature resistance of 1200℃ |
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| 01H-6301 |
Silver paste |
550~900℃ |
Welding silver paste, in膏状 form, is used for bonding wires and pads, ensuring reliable welding with minimal shrinkage. It can be used for bonding metal wires to metal layers, ceramics to ceramics, or ceramics to metals, etc. |
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| 55H-1803 |
Platinum paste |
850~1300℃ |
Platinum electrodes, sintered at 850 - 1300℃, meet the requirements of most external electrodes and high-temperature co-sintering, and can be repeatedly sintered multiple times. |
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| 01H-6301D |
Silver paste |
550~900℃ |
Sintering at 550 - 900℃, applying soldering silver paste, the welding is reliable and has fluidity. |
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| 55H-1803D |
Platinum paste |
1000~1300 ℃ |
Commonly used platinum electrodes, sintered at a temperature range of 1000 to 1300℃. The sensor sintered electrode can withstand a temperature of 1400 to 1500℃. It can meet the requirement of long-term operation within 1000℃ and can be re-fired multiple t |
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| 01H-6602B |
Silver paste |
550~750℃ |
Sintering at temperatures ranging from 550 to 750 degrees Celsius is possible. Materials such as electromagnetic thermal conductive borosilicate glass, quartz glass, and microcrystalline glass can be used. |
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| 01M-0705 |
Silver paste |
600℃ |
Sintered at 600℃, microcrystalline glass |
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| 01M-2605 |
Silver paste |
500℃ |
Sintered at 500℃, high borosilicate glass |
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| 01M-4900 |
Silver paste |
After the glass is thermally stabilized |
Tempered glass silver paste, applied and tempered together with the glass. |
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| 01M-5805 |
Silver paste |
500℃烧结 |
500℃烧结，石英玻璃 |
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| 01M-6301 |
Welding wire silver paste |
450~800℃ |
Welding wire silver paste, in膏状 form, with a minimum melting point of 450℃， used for bonding wires and pads |
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| 09LWE03 |
High-temperature resin |
150-200℃ |
Used for bonding, filling, and gluing of ceramic, metal, glass and other substrates. With a maximum operating temperature of 350℃. Colorless. |
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| 07MTF380 |
Glass slurry |
380~400℃ |
For bonding, filling gaps and gluing wires on ceramic, metal, glass and other substrates. With a maximum operating temperature of 450℃. Green color. |
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| 07MTHS400 |
Glass slurry |
450~650℃ |
Thick-film circuit filling holes, device bonding, transparency |
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| 07M-SL31 |
Glass slurry |
550~600℃ |
By printing, sintering, bonding ceramic, metal, glass and other flat components, colors such as colorless, blue, black, and green are available. |
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