| P/N |
Composition |
Firing Temperature |
Key Features & Applications |
Datasheet |
| 09LWE03 |
High-temperature resin |
150-200℃ |
Used for bonding, filling, and gluing of ceramic, metal, glass and other substrates. With a maximum operating temperature of 350℃. Colorless. |
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| 07MTF380 |
Glass slurry |
380~400℃ |
For bonding, filling gaps and gluing wires on ceramic, metal, glass and other substrates. With a maximum operating temperature of 450℃. Green color. |
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| 07MTHS400 |
Glass slurry |
450~650℃ |
Thick-film circuit filling holes, device bonding, transparency |
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| 07M-SL31 |
Glass slurry |
550~600℃ |
By printing, sintering, bonding ceramic, metal, glass and other flat components, colors such as colorless, blue, black, and green are available. |
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| 07H-3033 |
Glass slurry |
730~780℃ |
By printing, sintering, bonding ceramic, metal, glass and other flat components, colors such as colorless, blue, black, and green are available. |
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| 07H-1805 |
Glass slurry |
850℃ |
By printing, sintering, bonding ceramic, metal, glass and other flat components, colors such as colorless, blue, black, and green are available. |
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| 07H-GT90 |
Glass slurry |
850~1050℃ |
Used for bonding, filling and gluing of ceramic, metal, glass and other substrates. With a maximum operating temperature of 1050℃. Colorless. Can be diluted and then used for screen printing, sintering and bonding of flat components such as ceramics, meta |
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